High temperature diffusion bonding for sintered alumina. 2nd report. Evaluation of bonding strength and microstructure.
Sugita, Tadaaki, Abraya, Kimio, Ueda, KanjiVolume:
32
Year:
1985
Journal:
Journal of the Japan Society of Powder and Powder Metallurgy
DOI:
10.2497/jjspm.32.90
File:
PDF, 1.65 MB
1985