Electrodeposition of Copper from Ethylenediamine Complex Solution and Properties of Deposit.
MIZUMOTO, Shozo, NAWAFUNE, Hidemi, HIROO, Takao, ZHANG, Yun-San, HAGA, MasakiVolume:
43
Year:
1992
Journal:
Journal of the Surface Finishing Society of Japan
DOI:
10.4139/sfj.43.978
File:
PDF, 664 KB
1992