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Special Issue/Recent Trend and Future of Surface Finishing for Printed Wiring Boards Reviews. Tin-Lead Plating Technology for Printed Wiring Board.
MIURA, Takeshi, SEITA, MasaruVolume:
44
Year:
1993
Journal:
Journal of the Surface Finishing Society of Japan
DOI:
10.4139/sfj.44.589
File:
PDF, 568 KB
1993