X 線回折法による半導体パッケージ用封止樹脂/銅界面の残留応力評価

X 線回折法による半導体パッケージ用封止樹脂/銅界面の残留応力評価

Kakara, Takeshi, Wakabayashi, Midori, Izumi, Atsushi
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Volume:
29
Year:
2017
Journal:
Seikei-Kakou
DOI:
10.4325/seikeikakou.29.159
File:
PDF, 2.36 MB
2017
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