Large-Scale 3D Chips: Challenges and Solutions for Design...

IPSJ Transactions on System LSI Design Methodology 2017 Vol. 10

Large-Scale 3D Chips: Challenges and Solutions for Design Automation, Testing, and Trustworthy Integration

Knechtel, Johann, Sinanoglu, Ozgur, Elfadel, Ibrahim (Abe) M., Lienig, Jens, Sze, Cliff C. N.
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Volume:
10
Year:
2017
Language:
english
Journal:
IPSJ Transactions on System LSI Design Methodology
DOI:
10.2197/ipsjtsldm.10.45
File:
PDF, 1.80 MB
english, 2017
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