A Study for Ultra Precision Processing of Silicon Wafer Lapping Stone. By New Lapping Stone instead of Free Abrasive Lapping Process.
TOMITA, Yoji, EDA, Hiroshi, NAKAMURA, MasaruVolume:
61
Year:
1995
Journal:
Journal of the Japan Society for Precision Engineering
DOI:
10.2493/jjspe.61.1428
File:
PDF, 6.79 MB
1995