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Displacement Deposition Behavior of Copper via Oxidative Dissolution of TiN Thin Film.
MURASE, Kuniaki, FURUTA, Shigeo, HIRATO, Tetsuji, AWAKURA, YasuhiroVolume:
52
Year:
2001
Journal:
Journal of the Surface Finishing Society of Japan
DOI:
10.4139/sfj.52.773
File:
PDF, 2.53 MB
2001