Microstructure and hardness of the Cu-SiC and Cu-diamond...

IOP Conference Series Materials Science and Engineering 2018 / 03 Vol. 330

Microstructure and hardness of the Cu-SiC and Cu-diamond composites produced by vacuum hot pressing

Krishna, S Chenna, Vikram, T, Viswanath, S, Subramanian, P K, Janardhana Reddy, J
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Volume:
330
Language:
english
Journal:
IOP Conference Series: Materials Science and Engineering
DOI:
10.1088/1757-899X/330/1/012059
Date:
March, 2018
File:
PDF, 1.17 MB
english, 2018
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