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Simulation Results of Prospective Next Generation 3D Thermopile Sensor and Array Circuitry Options
Verheyen, Erik, Erbsloh, Andreas, Viga, Reinhard, Vogt, HolgerYear:
2018
Language:
english
Journal:
IEEE Sensors Letters
DOI:
10.1109/LSENS.2018.2829265
File:
PDF, 932 KB
english, 2018