Investigation of Multiple Heat Source Effects in Lock-In...

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IEEE Transactions on Components Packaging and Manufacturing Technology 2018

Investigation of Multiple Heat Source Effects in Lock-In Thermography Applications in Semiconductor Packages

Ravi, Bharath Viswanath, Xie, Mayue, Goyal, Deepak
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Year:
2018
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2018.2822765
File:
PDF, 1.53 MB
english, 2018
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