Transient thermal stress analysis for a circumferentially...

Theoretical and Applied Fracture Mechanics 2018 / 08 Vol. 96

Transient thermal stress analysis for a circumferentially cracked hollow cylinder based on memory-dependent heat conduction model

Xue, Zhang-Na, Chen, Zeng-Tao, Tian, Xiao-Geng
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Volume:
96
Language:
english
Journal:
Theoretical and Applied Fracture Mechanics
DOI:
10.1016/j.tafmec.2018.04.008
Date:
August, 2018
File:
PDF, 890 KB
english, 2018
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