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[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - Development of Integrated Process-Ageing Modeling Methodology for Flip Chip on Flex Interconnections With Non-Conductive Adhesives
Zhang, Xiaowu, Wong, E. H., Rajoo, Ranjan, Iyer, Mahadevan K., Caers, J. F. J. M., Zhao, X. J.Year:
2005
Language:
english
DOI:
10.1115/IPACK2005-73020
File:
PDF, 273 KB
english, 2005