[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - Numerical Model to Analyse IC Chip Encapsulation Process
Kulkarni, Venkatesh M., Azid, Ishak Abdul, Seetharamu, K. N., Aswatha Narayana, P. A.Year:
2005
Language:
english
DOI:
10.1115/IPACK2005-73197
File:
PDF, 185 KB
english, 2005