[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - Analysis and Characterization of Embedded Resistors for Wideband Applications
Lu, Albert C. W., Wai, L. L., Fan, W., Wong, Stephen C. K., Yamazaki, Toshio, Jarcia, Jacinto Jun, Chin, Kim H.Year:
2005
Language:
english
DOI:
10.1115/IPACK2005-73345
File:
PDF, 572 KB
english, 2005