![](/img/cover-not-exists.png)
Achievement of Precise Edge Shapes of Silicon Wafers with Double-Layered Polishing Pads : Improvement of Edge Flatness Based on Static/Dynamic Model(Machine Elements, Design and Manufacturing)
MIYAKE, Takahiro, ENOMOTO, Toshiyuki, TABATA, NorikazuVolume:
76
Year:
2010
Language:
english
DOI:
10.1299/kikaic.76.981
File:
PDF, 852 KB
english, 2010