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Microsystem Technologies 2018 / 2

Enhancing airtightness of TGV through regulating interface energy for wafer-level vacuum packaging

Kuang, Yunbin, Xiao, Dingbang, Zhou, Jian, zhuo, Ming, Li, Wenyin, Hou, Zhanqiang, Cui, Hongjuan, Wu, Xuezhong
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Language:
english
Journal:
Microsystem Technologies
DOI:
10.1007/s00542-018-3804-7
Date:
February, 2018
File:
PDF, 1.32 MB
english, 2018
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