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Degradation Mechanism on Joint of Betweens Ag-Epoxy Conductive Adhesive and Sn/Ni Plating Chip by Reliability Test
JEONG, Woo-ju, NISHIKAWA, Hiroshi, OKUMI, Shinsuke, MIZUNO, Takehiro, ITOU, Daisuke, TAKEMOTO, TadashiVolume:
41
Year:
2005
Journal:
Journal of The Adhesion Society of Japan
DOI:
10.11618/adhesion.41.490
File:
PDF, 2.28 MB
2005