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In situ monitoring of copper plating process for printed circuit board; Investigation by photoacoustic technique.
YOSHIHARA, Sachio, TAKAHASHI, Ryouji, SATO, EiichiVolume:
41
Year:
1990
Journal:
Journal of the Surface Finishing Society of Japan
DOI:
10.4139/sfj.41.1065
File:
PDF, 736 KB
1990