[ASME ASME 2011 International Mechanical Engineering Congress and Exposition - Denver, Colorado, USA (November 11–17, 2011)] Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration - Thermal Performance and Reliability of Large-Area Bonded Interfaces in Power Electronics Packages
Narumanchi, Sreekant, DeVoto, Douglas, Mihalic, Mark, Popp, Tim, McCluskey, PatrickYear:
2011
Language:
english
DOI:
10.1115/IMECE2011-65399
File:
PDF, 1.38 MB
english, 2011