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Electroless copper plating by applying electrolysis. Application for a printed circuit board manufacturing process.
HONMA, Hideo, FUJINAMI, Tomoyuki, TAKAGI, HiroakiVolume:
41
Year:
1990
Journal:
Journal of the Surface Finishing Society of Japan
DOI:
10.4139/sfj.41.777
File:
PDF, 633 KB
1990