[ASME ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems - San Francisco, California, USA (July 17–22, 2005)] Heat Transfer: Volume 3 - Feature Evolution During Sub 100NM Gap-Fill and Etch
Mungekar, Hemant, Lee, Young S., Venkataraman, ShankarYear:
2005
Language:
english
DOI:
10.1115/HT2005-72326
File:
PDF, 200 KB
english, 2005