Multiphysics characterization of polymer-filled...

International Journal of Numerical Modelling: Electronic Networks, Devices and Fields 2018 / 04

Multiphysics characterization of polymer-filled through-silicon vias (PF-TSVs) for three-dimensional integration

Jin, Jing, Zhao, Wen-Sheng, Wang, Da-Wei, Zhou, Liang, Yin, Wen-Yan
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Language:
english
Journal:
International Journal of Numerical Modelling: Electronic Networks, Devices and Fields
DOI:
10.1002/jnm.2348
Date:
April, 2018
File:
PDF, 1.90 MB
english, 2018
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