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[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Rapid sintering of copper nanopaste by pulse current for power electronics packaging
Huang, Yuan, Hang, Chunjin, Tian, Yanhong, Zhang, He, Wang, Chenxi, Wang, XiuliYear:
2017
Language:
english
DOI:
10.1109/ICEPT.2017.8046517
File:
PDF, 706 KB
english, 2017