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[IEEE 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL (2017.5.30-2017.6.2)] 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Damage progression study of 3D TSV package during reflow, thermal shocks and thermal cycling
Rahangdale, Unique, Rajmane, Pavan, Doiphode, Aniruddha, Sakib, A. R., Misrak, Abel, Lohia, Alok, Agonafer, DerejeYear:
2017
Language:
english
DOI:
10.1109/itherm.2017.7992614
File:
PDF, 352 KB
english, 2017