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[IEEE 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition - Warsaw, Poland (2017.9.10-2017.9.13)] 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition - Investigation of the influence of voids on the reliability of LED solder joints by computer tomography and forward voltage measurements
Schwarzer, Christian, Lang, Kurt-Jurgen, Fuchs, Dennis, Rauer, Miriam, Kaloudis, Michael, Krugelstein, Andreas, Franke, JorgYear:
2017
Language:
english
DOI:
10.23919/EMPC.2017.8346840
File:
PDF, 791 KB
english, 2017