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[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - SACQ Solder Board Level Reliability Evaluation and Life Prediction Model for Wafer Level Packages
Lin, Wei, Pham, Quan, Baloglu, Bora, Johnson, MichaelYear:
2017
Language:
english
DOI:
10.1109/ECTC.2017.257
File:
PDF, 1.01 MB
english, 2017