[IEEE 2017 IEEE Electrical Design of Advanced Packaging and...

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[IEEE 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Haining (2017.12.14-2017.12.16)] 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Electromagnetic simulations of a neuromorphic hardware using PEEC and memristor SPICE models

Lee, Wooryong, Park, Junsik, Kim, Jingook
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Year:
2017
Language:
english
DOI:
10.1109/EDAPS.2017.8276969
File:
PDF, 583 KB
english, 2017
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