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[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Preparation of pine-like Cu-Ni-P coating and its application in 3D integration
Zhang, Wenjing, Wang, Yinghui, Suga, Tadatomo, Kawai, Hiromu, Yamamoto, Michitaka, Higurashi, Eiji, Fujino, Masahisa, Li, MingYear:
2017
Language:
english
DOI:
10.1109/ICEPT.2017.8046406
File:
PDF, 16.22 MB
english, 2017