[IEEE 2017 18th International Conference on Electronic...

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[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Study on the solder joint reliability of plastic ball grid array package for high reliability application

Lin, Pengrong, Lv, Xiaorui, Ding, Yajun
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Year:
2017
Language:
english
DOI:
10.1109/ICEPT.2017.8046704
File:
PDF, 3.90 MB
english, 2017
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