[IEEE 2016 6th Electronic System-Integration Technology Conference (ESTC) - Grenoble, France (2016.9.13-2016.9.15)] 2016 6th Electronic System-Integration Technology Conference (ESTC) - Enhanced electromigration (EM) reliability of Sn58Bi solder due to the incorporation of ZrO2 nanoparticles
Zhu, Ze, Li, Yi, Fengshun Wu,, Chan, Yan-cheongYear:
2016
Language:
english
DOI:
10.1109/estc.2016.7764722
File:
PDF, 14.84 MB
english, 2016