[IEEE 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Encapsulant thickness options as a factor to impact thermal performance of Chip-on-Board (COB) light emitting diodes
Huang, Linjuan, Shih, Yuchou, Shi, Frank G.Year:
2016
Language:
english
DOI:
10.1109/itherm.2016.7517550
File:
PDF, 893 KB
english, 2016