[ASME ASME 2010 International Mechanical Engineering Congress and Exposition - Vancouver, British Columbia, Canada (November 12–18, 2010)] Volume 4: Electronics and Photonics - Reliable Design of Electroplated Copper Through Silicon Vias
Liu, Xi, Chen, Qiao, Sundaram, Venkatesh, Muthukumar, Sriram, Tummala, Rao R., Sitaraman, Suresh K.Year:
2010
Language:
english
DOI:
10.1115/IMECE2010-39283
File:
PDF, 4.81 MB
english, 2010