Development of a New Multi Layer Substrate Bonding...

Development of a New Multi Layer Substrate Bonding Technology using Ag-Sn Liquid Phase Sintering Process (First Report) -Investigations of Diffusion Processes-

Kondo, Koji, Yazaki, Yoshitaro, Shiraishi, Yoshihiko, Tada, Kazuo, Miura, Hideshi
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Volume:
57
Year:
2010
Journal:
Journal of the Japan Society of Powder and Powder Metallurgy
DOI:
10.2497/jjspm.57.10
File:
PDF, 1.10 MB
2010
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