[IEEE 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Haining (2017.12.14-2017.12.16)] 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Multiphysics modeling and simulation of ultra-thin channel Germanium on insulator (GeOI) MOSFETs
Chen, Wenchao, Wang, Manxi, Yin, Wen-Yan, Li, ErpingYear:
2017
Language:
english
DOI:
10.1109/EDAPS.2017.8276997
File:
PDF, 378 KB
english, 2017