[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Study on mechanical properties of low silver lead-free solders under combined compression and shear loading
Chen, Cong, Yu, Yingjie, Niu, XiaoyanYear:
2017
Language:
english
DOI:
10.1109/ICEPT.2017.8046568
File:
PDF, 1001 KB
english, 2017