![](/img/cover-not-exists.png)
[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Microstructures and shear properties of mixed assembly BGA structure SnAgCu/SnBi(Ag)/Cu joints in board-level packaging
Huang, Jia-Qiang, Zhou, Min-Bo, Zhao, Xing-Fei, Zhang, Xin-PingYear:
2017
Language:
english
DOI:
10.1109/ICEPT.2017.8046752
File:
PDF, 1.90 MB
english, 2017