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[IEEE 2018 IEEE International Symposium on Circuits and Systems (ISCAS) - Florence, Italy (2018.5.27-2018.5.30)] 2018 IEEE International Symposium on Circuits and Systems (ISCAS) - Buffered-Interconnect Performance and Power Dissipation in 3D ICs with Temperature Profile
Vendra, Satya K., Chrzanowska-Jeske, MalgorzataYear:
2018
Language:
english
DOI:
10.1109/ISCAS.2018.8351416
File:
PDF, 565 KB
english, 2018