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[IEEE International Symposium on Electronic Materials and Packaging (EMAP2000) - Hong Kong, China (30 Nov.-2 Dec. 2000)] International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) - Effects of flux residue and thermomechanical stresses on delamination failure in flip chip packages
Man-Lung Sham,, Jang-Kyo Kim,Year:
2000
Language:
english
DOI:
10.1109/emap.2000.904167
File:
PDF, 718 KB
english, 2000