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[IEEE Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium - Austin, TX, USA (18-19 Oct. 1999)] Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330) - Eutectic bump evaluation with various passivation and polyimide structures [flip chip interconnects]
Mistry, A., Ananthanarayanan, K., Mitchell, D., Qing Tan,, Beddingfield, C., Mathew, V., Sarihan, V., Smith, J.Year:
1999
Language:
english
DOI:
10.1109/iemt.1999.804808
File:
PDF, 1.22 MB
english, 1999