![](/img/cover-not-exists.png)
[IEEE 2016 IEEE International Symposium on Electromagnetic Compatibility - EMC 2016 - Ottawa, ON, Canada (2016.7.25-2016.7.29)] 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) - Analytical equivalent circuit modeling for multiple core vias in a high-speed package
Jin, Shuai, Zhang, Ji, Lim, Jane, Qiu, Kelvin, Brooks, Rick, Fan, JunYear:
2016
Language:
english
DOI:
10.1109/isemc.2016.7571650
File:
PDF, 4.43 MB
english, 2016