[IEEE 2017 IEEE SOI-3D-Subthreshold Microelectronics...

  • Main
  • [IEEE 2017 IEEE SOI-3D-Subthreshold...

[IEEE 2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) - Burlingame, CA (2017.10.16-2017.10.19)] 2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) - Towards 500°C SPER activated devices for 3D sequential integration

Micout, J., Sklenard, B., Batude, P., Berthelon, R., Rafhay, Q., Lacord, J., Mathieu, B., Pasini, L., Saghi, Z., Delaye, V., Brunet, L., Fenouillet-Beranger, C., Joblot, S., Mazen, F., Mazzocchi, V.,
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2017
Language:
english
DOI:
10.1109/s3s.2017.8309220
File:
PDF, 1.89 MB
english, 2017
Conversion to is in progress
Conversion to is failed