Contact Resistance Modeling of Sealed Relay Based on 3-D...

IEEE Transactions on Components Packaging and Manufacturing Technology 2018 / 3 Vol. 8; Iss. 3

Contact Resistance Modeling of Sealed Relay Based on 3-D Topography Reduction

Li, Wenhua, Zhou, Lulu, Kong, Meijuan, Zhao, Caitian
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Volume:
8
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2017.2769095
Date:
March, 2018
File:
PDF, 1.87 MB
english, 2018
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