Improving sidewall roughness by combined RIE-Bosch process
Fu, Jianyu, Li, Junjie, Yu, Jiahan, Liu, Ruiwen, Li, Junfeng, Wang, Weibing, Wang, Wenwu, Chen, DapengVolume:
83
Language:
english
Journal:
Materials Science in Semiconductor Processing
DOI:
10.1016/j.mssp.2018.04.033
Date:
August, 2018
File:
PDF, 1.32 MB
english, 2018