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[IEEE 2017 IEEE 5th International Symposium on Electromagnetic Compatibility (EMC-Beijing) - Beijing (2017.10.28-2017.10.31)] 2017 IEEE 5th International Symposium on Electromagnetic Compatibility (EMC-Beijing) - SPICE model for analyzing EMS responses of multilayer PCBs with nonlinear loads
Li, Xuelian, Du, ZhengweiYear:
2017
Language:
english
DOI:
10.1109/EMC-B.2017.8260469
File:
PDF, 285 KB
english, 2017