[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Size and boundary effects on the growth and morphology evolution of interfacial intermetallic compound of Sn0.3Ag0.7Cu/Cu micro-bump joints

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