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[IEEE 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Chengdu, China (2017.7.4-2017.7.7)] 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Failure analysis of a field failure return due to VIA related process
Luo, Robert, Yu, Dennis, Lai, Lainni, Shen, Abel, Wang, Wilson, Li, Ming, Chang, Chiakung, Chen, Jim, Xu, NinaYear:
2017
Language:
english
DOI:
10.1109/IPFA.2017.8060080
File:
PDF, 520 KB
english, 2017