[IEEE 2017 IEEE/MTT-S International Microwave Symposium -...

  • Main
  • [IEEE 2017 IEEE/MTT-S International...

[IEEE 2017 IEEE/MTT-S International Microwave Symposium - IMS 2017 - Honololu, HI, USA (2017.6.4-2017.6.9)] 2017 IEEE MTT-S International Microwave Symposium (IMS) - A micromachined packaging with incorporated RF-choke for integration of active chips at submillimeter-wave frequencies

Jam, Armin, East, Jack, Sarabandi, Kamal
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2017
DOI:
10.1109/MWSYM.2017.8058610
File:
PDF, 1.08 MB
2017
Conversion to is in progress
Conversion to is failed