[IEEE 2017 IEEE/MTT-S International Microwave Symposium - IMS 2017 - Honololu, HI, USA (2017.6.4-2017.6.9)] 2017 IEEE MTT-S International Microwave Symposium (IMS) - A micromachined packaging with incorporated RF-choke for integration of active chips at submillimeter-wave frequencies
Jam, Armin, East, Jack, Sarabandi, KamalYear:
2017
DOI:
10.1109/MWSYM.2017.8058610
File:
PDF, 1.08 MB
2017