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[IEEE 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition - Warsaw, Poland (2017.9.10-2017.9.13)] 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition - Comparative FEM thermo-mechanical simulations for built-in reliability: Surface mounted technology versus embedded technology for silicon dies
Balmont, Mickael, Bord-Majek, Isabelle, Ousten, YvesYear:
2017
Language:
english
DOI:
10.23919/EMPC.2017.8346867
File:
PDF, 571 KB
english, 2017