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Effect of Cu and Ni Addition on High Temperature Deformation Behavior in Sn-Cu-Ni Solder Alloys
Takano, Masayuki, Kuroda, Keiji, Hase, Kohei, Tanaka, Shuuto, Yamasaki, Shigeto, Mitsuhara, Masatoshi, Nakashima, HideharuVolume:
81
Year:
2017
Language:
english
DOI:
10.2320/jinstmet.j2016069
File:
PDF, 1.93 MB
english, 2017