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Solderjet bumping packaging technique optimization for the miniaturization of laser devices
Ribes-Pleguezuelo, P., Septriani, B., Zhang, S., Beckert, E., Eberhardt, R., Wyrowski, F., Tünnermann, A.Volume:
13
Language:
english
Journal:
Journal of the European Optical Society-Rapid Publications
DOI:
10.1186/s41476-017-0063-7
Date:
December, 2017
File:
PDF, 2.10 MB
english, 2017